Peripheral equipment in an SMT (Surface Mount Technology) production line plays a critical role in supporting the core machines—printer, pick-and-place machine, and reflow oven—to achieve automation, efficiency, and reliability. According to the production flow and functional requirements, these auxiliary devices can be categorized as follows:
Automatic Loader
Function: Positioned at the beginning of the line, automatically feeds PCBs into downstream equipment based on request signals.
Variants: Combined magazine/vacuum loader for flexible loading modes.
Automatic Unloader (PCB Stacker)
Function: Located at the end of the line, automatically collects and stores processed PCBs.
Intelligent option: NG/OK sorter integrated with AOI feedback to separate defective and good boards.
Conveyor (Linking Station)
Function: Connects equipment along the production line, enables PCB buffering, transfer, or in-line inspection/manual insertion.
Shuttle Conveyor
Function: Bridges single-lane and dual-lane equipment (e.g., single-lane pick-and-place → dual-lane reflow), enabling “merge” or “split” operations to reduce equipment costs.
Special type: Corner conveyor designed for factory space optimization.
Multi-function Buffer
Function: Temporarily stores NG boards after AOI/SPI inspection, automatically diverts them to manual rework while passing good boards to the next stage.
NG Buffer Conveyor
Function: Uses lifting mechanism to hold defective boards; simpler structure compared to a multi-function buffer.
Rework Stations
Composition: Includes soldering irons, rework benches, and related tools for repairing defective PCBs.
Inverter (Flipper Unit)
Function: Automatically flips PCBs by 180° for continuous double-sided assembly processes.
Automatic PCB Stacker
Function: Stacks PCBs at the line entrance and pushes them onto the conveyor; also serves as a buffer conveyor.
Solder Paste Mixer
Function: Uniformly mixes solder powder and flux to improve printing quality and reduce human error.
Cleaning Equipment
Function: Removes soldering residues (e.g., flux) to ensure electrical reliability (can be omitted in no-clean processes).
Dispensing Machine: Alternative to stencil printing, suitable for small-batch, high-mix solder paste or adhesive dispensing.
Solder Paste Inspection (SPI) System: Measures solder paste thickness, coverage, and volume distribution (formally an inspection tool, but often considered an auxiliary).
Baking Oven: Pre-bakes PCBs to remove moisture and prevent voids during reflow soldering.
SMT peripheral equipment centers around automated transfer (loaders/unloaders, conveyors), process support (flippers, solder paste mixers), and quality control/diversion (buffers, NG sorters), together enabling a high-efficiency, low-cost, and high-yield flexible production line. The actual configuration should be tailored to factory layout, production scale, and process complexity.
Contact Person: Ms. Kimi Liu
Tel: +86 135 106 75756
Fax: 86-131-0721-9945