Product Details:
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Repeat Position Accuracy: | ± 20.0 Micron @ 6 σ, Cpk ≥ 2.0 | Printing Speed / Cycle Time: | 0-200mm/ S |
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Max PCB Size: | 450*350mm | Min PCB Size: | 50*50mm |
PCB Thickness: | 0.4~6mm | Squeegee Length: | 220-500mm |
Net Weight: | 1000kg | Dimension: | 1140*1400*1480mm |
Highlight: | Full Auto SMT Stencil Printer,Silk Screen Printing Solder Paste Printer |
High Precision GD450+ Fully Automatic Solder Paste Printer SMT Stencil Printer Screen Printing Machine for SMT Assembly Line
Description
GD450+ full-automatic solder paste printer is a high accuracy classic model, with simple and reliable, accurate positioning and easy to adjust structure. Sold big amount in the market, ensure the stability.
1. Accurate optical positioning system
Four way light source is adjustable, light intensity is adjustable, light is uniform, and imag acquisition is more perfect; Good identification (including uneven mark points), suitable for tinning, copper plating,Gold plating, tin spraying, FPC and other types of PCB with different colors.
2. High efficiency and high adaptability stencil cleaning system
The new wiping system ensures full contact with the stencil ; three cleaning methods of dry, wet and vacuum, and free combination can be selected; soft wear-resistant rubber wiping plate, thorough cleaning, convenient disassembly, and universal length of wiping paper.
3. Intelligent squeegee system
Intelligent programmable setting, two independent direct motors driven squeegee, built-in precise pressure control system.
4. Simple and reliable PCB positioning system
Adaptive PCB board thickness, software tunable flexible side pressure and magnetic supporting device.
GD450+ Specificataion | |
PCB Parameter | |
Max PCB size (X x Y) | 450mm x 350mm |
Min PCB size (Y x X) | 50mm x 50mm |
PCB Thickness | 0.4mm~14mm |
Warpage | Max. PCB Diagonal 1% |
Max PCB weight | 10Kg |
PCB margin gap | 3 mm(conveyor belt PCB/frame touching width) |
Max bottom gap | 15mm |
Conveyor Speed | 1500mm/s(Max) |
Converyor height | 900±40mm |
Conveyor direction | L – R,R – L,L – L,R – R |
Conveyor method | Single rail |
PCB fixing method |
Software adjustable pressure elastic side pressure (options: 1, bottom holistic suction vacuum;2, bottom multi-point area vacuum; 3, edge locking substrate clamping) |
PCB support Method | Magnetic thimble,equal high block,vacuum suction cavity(option:Grid-Lok) |
Printing Parameter | |
Printing head | Linear motor type close loop printing head |
Stencil frame size | 370mm x 470mm~737 mm x 737 mm |
Max printing area (X x Y) | 450mm x 350mm |
scraper type | steel scraper/rubber scraper(45°/55°/60) |
scraper length | 220mm~500mm |
scraper height | 65±1mm |
scraper thickness | 0.25mm Diamond-like carbon coating |
Printing method | Single or dual scraper |
Mould release length | 0.02 mm 至 12 mm |
Printing | 0 ~ 200 mm/s |
Printing Pressure | 0.5kg -10Kg |
Printing length | ±250 mm(from center) |
Cleaning system | |
Cleaning method Vacuum Dry Cleaning-Vacuum Wet Cleaning-Dry Cleaning (Programming Control) | |
Cleaning direction forth-back,Back and forth cleaning (programmed control) | |
Camera Parameter | |
Imaging area (FOV) | 6.4mm x 4.8mm |
Platform adjustment range | X,Y:±7.0mm,θ:±2.0°. |
Datum point type | Standard shape reference point (see SMEMA standard), pad/hole |
Camera System | Single camera, up/down single imaging vision system, geometric matching positioning |
Function Parameter | |
Repetitive accuracy of image calibration | ±10.0um @6 σ,Cp more than 2.0 |
Printing Repetition Accuracy | ±20.0um @6 σ,Cp more than 2.0 |
Cycle time | Less than 7s |
Product changing time | Less than 5 mins |
Equipment | |
Power Supply | AC220V±10%,50/60HZ,15A |
Air supply | 4~6Kg/cm2, 10.0mm tube |
Operation System | Windows XP |
Dimension | L(1140mm)x W(1400mm)xH(1480mm) |
Weight | 1000Kg |
Temperature humidity control system(Option) | |
Temperature Control Range | 23±3℃ |
Humidity Control Range | 45~70%RH4 |
1. Automatic solder paste filling function
Regular and fixed point automatic addition of solder paste,to ensure the quality of solder paste and the amount of solder paste in the stencil. In order to ensure that the customer can carry out the quality of stable and continuous printing for a long time, improve productivity.
Can be real-time monitoring the roll diameter of the solder paste on screen trigger automatically add functionality
2. Detection function of solder paste margin of stencil
Real time detection of solder paste margin (thickness) on stencil,intelligent prompt for tin filling
3. Detection functionof Stencil plugging
By compensating the light source above the stencil, CCD is used to check the mesh in real time,so as to quickly detect and judge whether the stencil is blocked after cleaning,and carry out automatic cleaning, which is a supplement to the 2D detection of PCB.
4. Automatic dispensing function
According to different printing process requirements, PCB can be accurately dispensing tin,line drawing,filing and other functional operations after printing.
5. Squeegee pressure close-loop feedback control
Built in precise digital pressure sensor control system, through the squeegee pressure feedback system, it can accurately display the original pressure value of the squeegee,intelligently adjust the depth of the squeegee pressure,ensure the constant pressure value inthe printing process and obtain the highest process control, and realize the perfect printing of high-density and fine spacing devices.
6. Temperature and humidity control function
Automatic regulation and supervision of temperature and humidity in the printing press to ensure the stable physical characteristics of printing Materials.
7. Magnetic squeegee
Magnetic adsorption squeegee blade,instead of screw hole positioning mode, convenient and quick replacement.
8. Vacuum suction plate and upperpress function
It can automatically clamp PCB of various sizes and thicknesses to effectively overcome the deformation of the board,Make sure that the tin is evenly printed.
9. Support MES system seamless docking
It can scan the 1D code 2D code on the customer PCB and record the relevant information.which can be shared with the customer MES system. MES system uses 2D code,1D code, mobile IOT and other technologies to conduct scientific management on the warehouse material preparation and prevention, incoming material picking management, material loading and error prevention,production scheduling,quality traceability,Kanban control,etc. in the SMT production process. Through the optimization process to improve the production efficiency,improve product quality,shorten the production cycle, reduce the manufacturing cost,to achieve a comprehensive and scientific traceability management,to help enterprises quickly respond to market changes, improve the core competitiveness.
10. SPI online function interface
A closed-oop system is formed by connecting with SPI.After receiving feedback information of defective SPI printing, the machine will automatically adjust the offset according to SPI feedback. The XY offset can be adjusted automatically within 3PC.and clean the stencil, improve the printing quality and production efficiency,constitute a complete printing feedback system.
Full automatic SMT production line facotory site:
Charmhigh, top Chinese brand.
Service & Warranty:
The complete machine has a warranty period of 1 year from the time of purchase and lifetime service.
We always provide spare parts of machine, factory direct supply with guarantee.
We provide online Q/A and troubleshooting support and technical advice service.
We provide one to one after-sale service. Each machine 100% tested well before ship out.
Tech support:
Kimi's Mob/ WhatsApp: 0086 135 106 75756
Skype: kimiliu89
E-mail: kimi@charmhigh-tech.com
Welcome to follow us in YouTube: www.youtube.com/kimiLiuCharmhigh
If you want to know more information, please contact us by E-mail.
We will response you at the first time.
Contact Person: Ms. Kimi Liu
Tel: +86 135 106 75756
Fax: 86-131-0721-9945